Type
Text
Type
Dissertation
Advisor
Kao, Imin | Robert Kukta | Chad S. Korach | Lei Zuo | Teng-fong Wong | Michael Dudley
Date
2010-08-01
Keywords
axially moving continua, free abrasive machining, Green's function, lapping, wiresaw | Engineering, Mechanical
Department
Department of Mechanical Engineering
Language
en_US
Source
This work is sponsored by the Stony Brook University Graduate School in compliance with the requirements for completion of degree.
Identifier
http://hdl.handle.net/11401/70908
Publisher
The Graduate School, Stony Brook University: Stony Brook, NY.
Format
application/pdf
Abstract
To achieve the stringent requirements for the future specification of wafers, the progress in wafering processes such as slicing, lapping, grinding, and polishing is critical. The improvement of the existing technology and the innovation of advanced machining tools are necessary for the future wafer production. For example, study of vibration of a moving wire in slurry wiresaws and active control of such vibration can reduce kerf loss, and in turn reduce the cost of wafer manufacturing. Such study can also contribute to a better surface finish with less subsurface damages. Mixed abrasives in slurry can increase material removal rate in lapping to reduce time of machining and cost. In this dissertation, the research on the vibration of the wire in the slurry wiresaw system, mixed abrasive effect in lapping process, and wafer surface finishing by CNT brush are studied. Both free and forced vibration response of damped axially moving wire are derived by modal analysis and the Green's function, respectively. The eigensolutions, orthogonality, frequency of damped vibration, and frequency response with a point excitation are also obtained. Two different sizes of abrasives, F-400 and F-600 SiC, are mixed with different ratios in the slurry for lapping process. The results show that mixed abrasive grits can enhance the material removal rate. However, the surface roughness becomes slightly worse. CNT brush is introduced as a new polishing tool. Preliminary experimental results are presented.
Recommended Citation
Chung, Chun-Hui, "Modeling and Experimental Study of Wafer Manufacturing and Machining Processes" (2010). Stony Brook Theses and Dissertations Collection, 2006-2020 (closed to submissions). 116.
https://commons.library.stonybrook.edu/stony-brook-theses-and-dissertations-collection/116